Applications for the European Supply Chain Professional Scholarships are now invited. Only students from European countries are welcome to apply. He or she must be a prospective student at MIT-Zaragoza Master of Engineering in Logistics and Supply Chain Management (ZLOG) program. The winning students will receive a tuition fee reduction.
Scholarship Description
Through MIT-Zaragoza European Scholarship, ZLC hopes to attract outstanding future leaders from European countries. Candidates will be expected to show extraordinary potential for leadership and professional success, bringing new vision and commitment to the area of Logistics and Supply Chain Management.
Award Value
Successful applicants will receive a tuition fee discount ranging from 25% (€ 6,000), 50% (€ 12,000) for the ZLOG program
Level and Area of Studies
Master of Engineering in Logistics and Supply Chain Management (ZLOG).
Place of Study
The study will be taken in Spain.
Eligibility and Criteria
- Granted admission to the MIT-Zaragoza Master of Engineering in Logistics and Supply Chain Management (ZLOG) program.
- Completion of a four year undergraduate program equivalent to a Bachelor’s Degree.
- Professional excellence with a background or experience in Logistics and Supply Chain Management, or exceptional academic achievement.
- Competitive GRE or GMAT score. Exceptions may be granted to individuals who have demonstrated strong professional and/or academic achievement in completing a college degree-including some quantitative training and evidence of advanced verbal and written proficiency in the English language.
- Fluency in English, competitive IELTS or TOEFL score. Exceptions may be granted to individuals who have demonstrated evidence of advanced verbal and written proficiency in the English language.
Applicants’ Nationality
Only those from European countries are welcome to apply these Supply Chain Professional Scholarships.
Application Instruction
All interested candidates are advised to visit the website and application link below to see the detail information of application procedure.
Submission Deadline
May 31, 2019.